Ultra-Wide Bandgap
Thermal Conductivity
Heat Dissipation vs Si
Breakdown Field
In a smart city, daily life relies on high-performance innovations, from the AI powering autonomous vehicles to data centres running next-generation cloud computing. None of this is possible without semiconductors, the essential ingredient in every electronic chip.
While silicon has long been the standard, 6C Technology is advancing the field with a lab-grown alternative: diamond, a "supermaterial with extreme properties."
Using a proprietary Microwave Plasma Chemical Vapour Deposition (MPCVD) process with high-purity hydrogen, our team accelerates the growth of diamonds for industrial use at commercial scale.
We are overcoming physics barriers to meet the demands of advanced technologies that underpin the digital age.
Preventing thermal overload in AI clusters. Diamond dissipates heat 15x faster than silicon, preventing throttling.
Enabling high-power charging for EVs. High breakdown voltage (20 MV/cm) allows for smaller, more efficient grid components.
Room temperature Qubits. Nitrogen-Vacancy (NV) centers act as stable qubits without the need for cryogenic cooling.
Supporting 6G networks. Diamond's low dielectric constant and high frequency handling are ideal for next-gen wireless.
Extreme wear resistance. Diamond components provide unmatched durability for high-stress joints in advanced robotics.
Chemically inert and safe. Enabling long-term medical implants, neural interfaces, and advanced biosensors.
Operating where silicon melts. Diamond electronics function reliably in high-temperature aerospace and industrial settings.
Next-gen Solar & Storage. Using diamond nanomembranes for efficient solar cells and electrochemical CO2 conversion.
Broad spectrum transparency. Ideal for high-power laser windows and advanced optical sensors (UV to IR).